CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

MOQ:1Set
Price:can negotiate
PRODUCT DESCRIPTION
High Light:

x ray equipment

,

electronic inspection equipment

Brand Name UNICOMP
Certification CE, FDA
Delivery Time 30 days
Minimum Order Quantity 1Set
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ABOUT US
Unicomp Technology
Unicomp Technology manufacturer profile
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming New District, Shenzhen ,China
5.0
Verified Supplier
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CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
MOQ: 1Set
Price:can negotiate
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About Us
Unicomp Technology
Unicomp Technology manufacturer profile
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming New District, Shenzhen ,China
5.0
Verified Supplier
Company Name Unicomp Technology
Business Type: Manufacturer,Exporter,Seller
Brands: UNICOMP
No. of Employees: 300~400
Year Established: 2002
Annual Sales: Twenty Million-Forty Million
Company Location Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming New District, Shenzhen
Factory Location Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming New District, Shenzhen
China Unicomp Technology manufacturer profile
China Unicomp Technology manufacturer profile
China Unicomp Technology manufacturer profile
China Unicomp Technology manufacturer profile
China Unicomp Technology manufacturer profile

X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System)

 

 

Unicomp Technology was incorporated in 2002. It is a national level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equipment. Unicomp has become the leading enterprise in domestic X-ray industry. This technology is widely applied in Public Security, Lithium battery, EMS, IC, Semiconductor, Solar Photovoltaic, LED, Connector, Automotive Parts, Wheel, Tires, Pressure vessel industry etc.

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Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to advance the core technology of X-ray imaging. Presently Unicomp has submit a total of 432 patents with 319 authorized. Unicomp has obtained numerous management system certification, such as ISO 9001 quality management system, ISO 14001 environmental management system, OHSAS18001 occupational health & safety management system, as well as ISO27001 information safety management system.

 

Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 50,000㎡ respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service support in USA, Canada, Mexico, Brazil, Germany, United Kingdom, France, Italy, Spain, Australia, Hungary, Romania, Russia, Poland, Uzbekistan, South Africa, Morocco, Tunisia, Turkey, UAE, India, Singapore, Malaysia, Thailand, Vietnam , Philippines, Taiwan, Hong Kong.. This international connection has helped Unicomp to be recognized as a Global Force in today’s X-ray industry. Today “UNICOMP” is a hallmark brand in the industry both at home and abroad.

 

Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, JABIL, Elcoteq, Philips, GM, Bosch, TRW, Delphi, ABB, Continental, Creation technologies, Salcomp, Selcom, Computime, Emerson, LEAR, V.S. Industy, Microtronics, SVI, Toshiba, NEC, Canon, Olympus, OMRON, SANYO, Fujitsu, Honda Lock, Samsung, LG, Amphenol, Littelfuse, Murata, KEMET, ROHM, Hybrionic, Cooper, ELRAD, Sumida, ELDOR, USI, Inventec, AELTA, PRIVAX, LITEON, Sensata, LuXshare, LENS, AAC Technologies, SANGSHIN ELECOM, Hisense, Skyworth, KONKA, TCL, ZTE, CHANGHONG, WINGTEC, DBG, BYD, VIVO, HIKVISION, GOOD-ARK, DESAY SV, CATL, Panasonic, Sony, Boston Power, BAK, GUOXUAN HIGH-TECH, Sunwoda, Coslight, TENPOWER, BMW, Tesla, Audi, CHANGAN, DONGFENG Motor, Honda, EATON, Turkey MMS, SF Express just to name a few.

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PRODUCT DESCRIPTION
High Light:

x ray equipment

,

electronic inspection equipment

Place of Origin China
Brand Name UNICOMP
Certification CE, FDA
Model Number CX3000
Minimum Order Quantity 1Set
Price can negotiate
Packaging Details Wooden Case, Waterproof, Anti-collision
Delivery Time 30 days
Payment Terms T/T, L/C
Supply Ability 30 sets per month
Name Electronics X Ray Machine
Tube Voltage 100KV
Size 750(L)x570(W)x890(H)mm
X-ray Leakage < 1uSv/h
Power Consumption 0.5kW
Power 220AC/50Hz

 

CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

Description:

CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

 

 

X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.

 

 

X ray Inspecting Features:

 

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

 

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

 

(3) The test preparation time is greatly reduced.

 

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

 

(5) Double layers board and multi-layer boards only one check (with layered function).

 

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.

 

 

Item Definition Specs
System Parameters Size 750(L)x570(W)x890(H)mm
Weight 300kg
Power 220AC/50Hz
Power Consumption 0.5kW
X-ray Tube Type Closed
Max.Voltage 100kV
Max.Power 200μA
Spot Size 5μm
Detector Intensifier FPD
X-ray Coverage 48mm x 54mm
Resolution 208Lp/cm
Work Station Max.Loading Size 200mm x 200mm
Max.Inspection Area 200mm x 200mm
Oblique Angle Views 360° rotary fixture (Optional)
X-ray Leakage <1μSv/h


 

 

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